SDM236-B6900 Bearing 6900ZZ 45.4

SDM236-B6900 Bearing 6900ZZ 45.4

The parallel stencil-to-PCB lift system ensures uniform separation across the entire print area

The compact 16 kg solder pot remains stationary while the PCB moves across the wave

Wave Simulation Mode Checks Solder Coverage Area

How it Works

Missing part detection: stops and alerts operator

The system tracks placement in real time and allows production to resume exactly where it stopped

long-term operation

Precision Feeding & Adjustable Performance

Maintains ultra-low humidity below 5% RH

Parallel Lift System

This ensures full traceability and seamless integration into quality management systems

maintaining low ΔT and consistent thermal performance even at higher throughput levels