G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217

G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法 StdPbc-0217global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards SEMI G30 Test Method for Junction to Case Thermal Resistance Measurements of Ceramic Packages SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G38 Test Method for Still and Forced Air Junction to Ambient Thermal Resistance Measurements of Integrated Circuit Packages SEMI

Compared with damp heat (DH) tests

本仕様は，Global Information & Control Committeeで技術的に承認されたもので，North American Information & Control Committeeが直接責任を負うものである。現版は2004年12月10日にNorth American Regional Standards Committeeにて承認されている。2005年2月にまずwww

1  This Specification describes a method for data acquisition EDA Applications to request process and data from equipment to be communicated in an automated fashion by the equipment

safe and efficient recipe operation for production execution by the host

This Test Method is intended for use on single crystals of silicon in the form of circular wafers with a diameter greater than 16 mm (0

and reclaimed wafers

1  This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process

Report basic equipment state changes to a host computer

Test methods have been shown to give statistically valid results

It defines also how to apply an orientation fiducial mark on an otherwise unmarked wafer

lower space requirement

SEMI MF1528-94 (Reapproved 1999) (first SEMI publication)