M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical

M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - HistoricalThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published November 2001. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of this document is to provide a guide for evaluation of chemical mechanical polishing (CMP)

This Document covers requirements for carbon tetrafluoride (CF4) used in the semiconductor industry

This Specification provides common characteristics of Ag paste based on currently widely used for photovoltaic applications

org in February 2018

이 개정판의 발행은 2011년 12월 24일Audits and Reviews Subcommittee에 의해 승인되었다

SEMI MF1727-1110 (technical revision)

SEMI M62-0309 (technical revision)

ship/scrap)

本文書の範囲は半導体産業で使用されるトランス1，2ジクロロエチレンの提案された不純物限度の一覧作成である。

and textual process information

process parameters

It provides an indication of the flush volume required to bring particle levels to specification

orgで入手可能となる。初版は1999年6月発行。前版は2007年3月発行。