Fibre optic active components and devices. Package and interface standards - Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) Ingestion-build-156411 4 Hazards resulting from inhalation

4 Hazards resulting from inhalation of dust

BS EN ISO 14744-1:2008 specifies details of the main machine parameters (accelerating voltage

The emissivity is necessary for taking into account heat transfer by radiation from surfaces at the standard temperature of 283K in the determination of the U value and of the total solar transmittance of glazing

Method using a wheel

The methods described in this document include sample collection and the preparation of a representative sample based on a sampling plan for the purpose of determining dimensions

Fibre optic active components and devices. Package and interface standards - Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) Ingestion-build-156411 4 Hazards resulting from inhalationWhat is this standard about? This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine pitch ball grid array (S FBGA) and silicon fine pitch land grid array (S FLGA). In this document, the electrical interface for the S FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical