Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards) PAS 015 The standard must be used

The standard must be used in conjunction with another technical specification

7 describes methods for the preparation of test assemblies with various forms of hot melt adhesive by methods which simulate their use in shoe manufacturing for sole attaching

Information to be supplied by the manufacturer

which had previously been flagged up for a new standard

In cases where IUPAC nomenclature is not available due to uncertainty or ambiguity

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards) PAS 015 The standard must be used